3D Integrated Packaging Approach for High Performance Processor-Memory Module

S. C. Polzer; W. L. Wilkins; J. L. Fasig; M. J. Degerstrom; B. K. Gilbert; E. S. Daniel

doi:10.4071/isom-2013-WA15

Loading [Contrib]/a11y/accessibility-menu.js

Polzer, S. C., W. L. Wilkins, J. L. Fasig, M. J. Degerstrom, B. K. Gilbert, and E. S. Daniel. 2013. “3D Integrated Packaging Approach for High Performance Processor-Memory Module.” IMAPSource Proceedings 2013 (1): 452–57. https://doi.org/10.4071/isom-2013-WA15.

View more stats