3D Integrated Packaging Approach for High Performance Processor-Memory Module

Polzer, S. C., W. L. Wilkins, J. L. Fasig, M. J. Degerstrom, B. K. Gilbert, and E. S. Daniel. 2013. “3D Integrated Packaging Approach for High Performance Processor-Memory Module.” IMAPSource Proceedings 2013 (1): 452–57. https:/​/​doi.org/​10.4071/​isom-2013-WA15.