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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications
Zhenzhen Shen
,
Aleksey Reiderman
,
Casey Anude
,
Die Attach Durability Test
MCM assembly
Pressure-less nano-Ag sintering
Thin-Film
•
https://doi.org/10.4071/isom-2015-WP14
IMAPSource Conference Papers
Shen, Zhenzhen, Aleksey Reiderman, and Casey Anude. 2015. “Pressure-Less AgNP Sintering for High-Power MCM Assembly for Extreme Environment Applications.”
IMAPSource Proceedings
2015 (1): 342–48.
https://doi.org/10.4071/isom-2015-WP14
.
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