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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications

Zhenzhen Shen, Aleksey Reiderman, Casey Anude,
Die Attach Durability TestMCM assemblyPressure-less nano-Ag sinteringThin-Film
https://doi.org/10.4071/isom-2015-WP14
IMAPSource Conference Papers
Shen, Zhenzhen, Aleksey Reiderman, and Casey Anude. 2015. “Pressure-Less AgNP Sintering for High-Power MCM Assembly for Extreme Environment Applications.” IMAPSource Proceedings 2015 (1): 342–48. https:/​/​doi.org/​10.4071/​isom-2015-WP14.
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