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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Five layer Cu-coated Zn/Al clad solder for die attachment
Takuto Yamaguchi
,
Osamu Ikeda
,
Shohei Hata
,
Yuichi Oda
,
Kazuma Kuroki
,
Clad material
Die bonding
Oxidation resistance
Pb-free solder
SiC
•
https://doi.org/10.4071/isom-2013-THP33
IMAPSource Conference Papers
Yamaguchi, Takuto, Osamu Ikeda, Shohei Hata, Yuichi Oda, and Kazuma Kuroki. 2013. “Five Layer Cu-Coated Zn/Al Clad Solder for Die Attachment.”
IMAPSource Proceedings
2013 (1): 848–52.
https://doi.org/10.4071/isom-2013-THP33
.
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