Packaging Tradeoff for SIP Integration Targeting High Speed PAM-4 Applications

B Haentjens; G Desruelles; G Chrétien; A Leborgne; Y Haentjens; J Dupuy; F Jorge; A Konczykowska; I Beauvisage; R Delleme; D Martin; S Bila; K Frigui; S Ngoho; B Frigui; H Mardoyan

doi:10.4071/isom-Poster3

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Haentjens, B, G Desruelles, G Chrétien, A Leborgne, Y Haentjens, J Dupuy, F Jorge, et al. 2015. “Packaging Tradeoff for SIP Integration Targeting High Speed PAM-4 Applications.” IMAPSource Proceedings 2015 (1): 730–34. https://doi.org/10.4071/isom-Poster3.

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