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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies

Kyu Hawn Lee, Byung-Hyun Bae, Min-Su Jeong, Jeong-Kyu Kim, Young-Bae Park,
interfacial reliabilityscreen printingembedded packagingadhesionpeel test
https://doi.org/10.4071/isom-2016-Poster9
IMAPSource Conference Papers
Lee, Kyu Hawn, Byung-Hyun Bae, Min-Su Jeong, Jeong-Kyu Kim, and Young-Bae Park. 2016. “Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies.” IMAPSource Proceedings 2016 (1): 545–50. https:/​/​doi.org/​10.4071/​isom-2016-Poster9.
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