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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies
Kyu Hawn Lee
,
Byung-Hyun Bae
,
Min-Su Jeong
,
Jeong-Kyu Kim
,
Young-Bae Park
,
interfacial reliability
screen printing
embedded packaging
adhesion
peel test
•
https://doi.org/10.4071/isom-2016-Poster9
IMAPSource Conference Papers
Lee, Kyu Hawn, Byung-Hyun Bae, Min-Su Jeong, Jeong-Kyu Kim, and Young-Bae Park. 2016. “Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies.”
IMAPSource Proceedings
2016 (1): 545–50.
https://doi.org/10.4071/isom-2016-Poster9
.
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