Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies

Kyu Hawn Lee; Byung-Hyun Bae; Min-Su Jeong; Jeong-Kyu Kim; Young-Bae Park

doi:10.4071/isom-2016-Poster9

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Lee, Kyu Hawn, Byung-Hyun Bae, Min-Su Jeong, Jeong-Kyu Kim, and Young-Bae Park. 2016. “Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies.” IMAPSource Proceedings 2016 (1): 545–50. https://doi.org/10.4071/isom-2016-Poster9.

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