Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies
Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies
Lee, Kyu Hawn, Byung-Hyun Bae, Min-Su Jeong, Jeong-Kyu Kim, and Young-Bae Park. 2016. “Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies.” IMAPSource Proceedings 2016 (1): 545–50. https://doi.org/10.4071/isom-2016-Poster9.