Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Finite element analysis of lidded flip-chip packages: A study on the impact of thermal interface material compressibility and stress-free conditions on modeling predictions
Finite element analysis of lidded flip-chip packages: A study on the impact of thermal interface material compressibility and stress-free conditions on modeling predictions
Sinha, Tuhin. 2015. “Finite Element Analysis of Lidded Flip-Chip Packages: A Study on the Impact of Thermal Interface Material Compressibility and Stress-Free Conditions on Modeling Predictions.” IMAPSource Proceedings 2015 (1): 151–56. https://doi.org/10.4071/isom-2015-TP55.
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