Finite element analysis of lidded flip-chip packages: A study on the impact of thermal interface material compressibility and stress-free conditions on modeling predictions
Sinha, Tuhin. 2015. “Finite Element Analysis of Lidded Flip-Chip Packages: A Study on the Impact of Thermal Interface Material Compressibility and Stress-Free Conditions on Modeling Predictions.” IMAPSource Proceedings 2015 (1): 151–56. https://doi.org/10.4071/isom-2015-TP55.