First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications

Nobuo Ogura; Siddharth Ravichandran; Tailong Shi; Atom Watanabe; Shuhei Yamada; Mohanalingam Kathaperumal; Rao Tummala

doi:10.4071/2380-4505-2019.1.000202

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Ogura, Nobuo, Siddharth Ravichandran, Tailong Shi, Atom Watanabe, Shuhei Yamada, Mohanalingam Kathaperumal, and Rao Tummala. 2019. “First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/Mm-Wave Applications.” IMAPSource Proceedings 2019 (1): 202–7. https://doi.org/10.4071/2380-4505-2019.1.000202.

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