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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications

Nobuo Ogura, Siddharth Ravichandran, Tailong Shi, Atom Watanabe, Shuhei Yamada, Mohanalingam Kathaperumal, Rao Tummala,
Glass Panel Embedding (GPE)3D SiPEpoxy Molding CompoundUltra-thin5G and mm wave
https://doi.org/10.4071/2380-4505-2019.1.000202
IMAPSource Conference Papers
Ogura, Nobuo, Siddharth Ravichandran, Tailong Shi, Atom Watanabe, Shuhei Yamada, Mohanalingam Kathaperumal, and Rao Tummala. 2019. “First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/Mm-Wave Applications.” IMAPSource Proceedings 2019 (1): 202–7. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.000202.
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