Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Characteristic Life Based Acceleration Transforms for Lead-Free Solder Joint Reliability under Thermal Cycling Conditions
Characteristic Life Based Acceleration Transforms for Lead-Free Solder Joint Reliability under Thermal Cycling Conditions
Ahmad, Mudasir, and Kuo-Chuan Liu. 2010. “Characteristic Life Based Acceleration Transforms for Lead-Free Solder Joint Reliability under Thermal Cycling Conditions.” IMAPSource Proceedings 2010 (1): 212–19. https://doi.org/10.4071/isom-2010-TP2-Paper3.