Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging
Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging
Häußler, Felix, Shengxia Shen, Simon Petillon, Sascha Weser, Mehmet Haybat, Wolfgang Eberhardt, André Zimmermann, and Jörg Franke. 2020. “Evaluating Thermoset Resin Substrates for 3D Mechatronic Integrated Devices and Packaging.” IMAPSource Proceedings 2020 (1): 140–45. https://doi.org/10.4071/2380-4505-2020.1.000140.