Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging

Felix Häußler; Shengxia Shen; Simon Petillon; Sascha Weser; Mehmet Haybat; Wolfgang Eberhardt; André Zimmermann; Jörg Franke

doi:10.4071/2380-4505-2020.1.000140

Häußler, Felix, Shengxia Shen, Simon Petillon, Sascha Weser, Mehmet Haybat, Wolfgang Eberhardt, André Zimmermann, and Jörg Franke. 2020. “Evaluating Thermoset Resin Substrates for 3D Mechatronic Integrated Devices and Packaging.” IMAPSource Proceedings 2020 (1): 140–45. https://doi.org/10.4071/2380-4505-2020.1.000140.

View more stats