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Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Bond Over Active Circuitry Design for Reliability

Stevan Hunter, Jose Martinez, Cesar Salas, Marco Salas, Jason Schofield, Steven Sheffield, Kyle Wilkins, Bryce Rasmussen, Troy Ruud, Jim Workman,
bond pad wirebonding Cu wire pad design pad layout wirebond reliability
• https://doi.org/10.4071/isom-2011-TP2-Paper4
IMAPSource Conference Papers
Hunter, Stevan, Jose Martinez, Cesar Salas, Marco Salas, Jason Schofield, Steven Sheffield, Kyle Wilkins, Bryce Rasmussen, Troy Ruud, and Jim Workman. 2011. “Bond Over Active Circuitry Design for Reliability.” IMAPSource Proceedings 2011 (1): 249–57. https://doi.org/10.4071/isom-2011-TP2-Paper4.
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