Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer

Quanling Zheng; M. Ashraf Khan; Alfred M. Kriman; Gary H. Bernstein

doi:10.4071/isom-2012-TP55

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Zheng, Quanling, M. Ashraf Khan, Alfred M. Kriman, and Gary H. Bernstein. 2012. “Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer.” IMAPSource Proceedings 2012 (1): 441–46. https://doi.org/10.4071/isom-2012-TP55.

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