Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer

Quanling Zheng; M. Ashraf Khan; Alfred M. Kriman; Gary H. Bernstein

doi:10.4071/isom-2012-TP55

Zheng, Quanling, M. Ashraf Khan, Alfred M. Kriman, and Gary H. Bernstein. 2012. “Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer.” IMAPSource Proceedings 2012 (1): 441–46. https://doi.org/10.4071/isom-2012-TP55.

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Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer

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