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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Packaging Materials for 2.5/3D Technology
Brian Schmaltz
,
2.5d
3d
packaging materials
interposer
thru silicon via
tsv
thermal compression bonding
tcb
cu pillar
•
https://doi.org/10.4071/isom-2013-TP33
IMAPSource Conference Papers
Schmaltz, Brian. 2013. “Packaging Materials for 2.5/3D Technology.”
IMAPSource Proceedings
2013 (1): 276–84.
https://doi.org/10.4071/isom-2013-TP33
.
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