Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale Packaging
Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale Packaging
Enquist, Paul. 2010. “Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale Packaging.” IMAPSource Proceedings 2010 (1): 15–22. https://doi.org/10.4071/isom-2010-TA1-Paper3.
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