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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale Packaging
Paul Enquist
,
low temperature oxide bonding
3D integration
DBI®
metal direct bonding
backside illuminated image sensors
•
https://doi.org/10.4071/isom-2010-TA1-Paper3
IMAPSource Conference Papers
Enquist, Paul. 2010. “Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale Packaging.”
IMAPSource Proceedings
2010 (1): 15–22.
https://doi.org/10.4071/isom-2010-TA1-Paper3
.
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