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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

PERFORMANCE EVALUATION OF GOLD (Au) WIRE AND RIBBON INTERCONNECTS IN HIGH FREQUENCY CIRCUITS

Cenk Atalan, Taylan Eker,
Wire bonding Ribbon bonding Au wire Au ribbon Thermosonic bonding Parallel gap welding Resistance welding RF circuit interconnects
• https://doi.org/10.4071/isom-2016-THA35
IMAPSource Conference Papers
Atalan, Cenk, and Taylan Eker. 2016. “PERFORMANCE EVALUATION OF GOLD (Au) WIRE AND RIBBON INTERCONNECTS IN HIGH FREQUENCY CIRCUITS.” IMAPSource Proceedings 2016 (1): 450–55. https://doi.org/10.4071/isom-2016-THA35.
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