Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
PERFORMANCE EVALUATION OF GOLD (Au) WIRE AND RIBBON INTERCONNECTS IN HIGH FREQUENCY CIRCUITS
Cenk Atalan
,
Taylan Eker
,
Wire bonding
Ribbon bonding
Au wire
Au ribbon
Thermosonic bonding
Parallel gap welding
Resistance welding
RF circuit interconnects
•
https://doi.org/10.4071/isom-2016-THA35
IMAPSource Conference Papers
Atalan, Cenk, and Taylan Eker. 2016. “PERFORMANCE EVALUATION OF GOLD (Au) WIRE AND RIBBON INTERCONNECTS IN HIGH FREQUENCY CIRCUITS.”
IMAPSource Proceedings
2016 (1): 450–55.
https://doi.org/10.4071/isom-2016-THA35
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats