Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS® Finite Element Analysis
Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS® Finite Element Analysis
Mallik, Aditi, and Roger Stout. 2010. “Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS® Finite Element Analysis.” IMAPSource Proceedings 2010 (1): 364–71. https://doi.org/10.4071/isom-2010-WA1-Paper3.
Powered by Scholastica, the modern academic journal management system