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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Package Qualification Envelope for 22FDX® Technology

Christian Klewer, Frank Kuechenmeister, Jens Paul, Dirk Breuer, Bjoern Boehme, Jae Kyu Cho, Simone Capecchi, Michael Thiele,
22FDX®FDSOICPIPackage Qualification MethodologyBEOLReliabilityWire bondFlip chipWLCSPWLPFO
https://doi.org/10.4071/2380-4505-2019.1.000169
IMAPSource Conference Papers
Klewer, Christian, Frank Kuechenmeister, Jens Paul, Dirk Breuer, Bjoern Boehme, Jae Kyu Cho, Simone Capecchi, and Michael Thiele. 2019. “Package Qualification Envelope for 22FDX® Technology.” IMAPSource Proceedings 2019 (1): 169–75. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.000169.
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