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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Bumping Co-planarity Collocation for Different UBM Size by Geometry Integration

Wei-Wei (Xenia) Liu, Berdy Weng, Lu-Ming Lai, Kuang-Hsiung Chen,
Co-planarity Cu Pillar Bump Oval Bump Circular Bump Solder Height Flip Chip
• https://doi.org/10.4071/2380-4505-2019.1.000476
IMAPSource Conference Papers
Liu, Wei-Wei (Xenia), Berdy Weng, Lu-Ming Lai, and Kuang-Hsiung Chen. 2019. “Bumping Co-Planarity Collocation for Different UBM Size by Geometry Integration.” IMAPSource Proceedings 2019 (1): 476–79. https://doi.org/10.4071/2380-4505-2019.1.000476.
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