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Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
Bumping Co-planarity Collocation for Different UBM Size by Geometry Integration
Wei-Wei (Xenia) Liu
,
Berdy Weng
,
Lu-Ming Lai
,
Kuang-Hsiung Chen
,
Co-planarity
Cu Pillar Bump
Oval Bump
Circular Bump
Solder Height
Flip Chip
•
https://doi.org/10.4071/2380-4505-2019.1.000476
IMAPSource Conference Papers
Liu, Wei-Wei (Xenia), Berdy Weng, Lu-Ming Lai, and Kuang-Hsiung Chen. 2019. “Bumping Co-Planarity Collocation for Different UBM Size by Geometry Integration.”
IMAPSource Proceedings
2019 (1): 476–79.
https://doi.org/10.4071/2380-4505-2019.1.000476
.
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