Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Reduction of Thermal Stress - Part III: UBM and Passivation Thickness Optimization
Reduction of Thermal Stress - Part III: UBM and Passivation Thickness Optimization
Sethu, Raj Sekar, Salil Hari Kulkarni, How Ung Ha, and Kok Heng Soon. 2017. “Reduction of Thermal Stress - Part III: UBM and Passivation Thickness Optimization.” IMAPSource Proceedings 2017 (1): 694–98. https://doi.org/10.4071/isom-2017-THP14_016.
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