Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes
Tulkoff, Cheryl, and Greg Caswell. 2011. “Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes.” IMAPSource Proceedings 2011 (1): 341–44. https://doi.org/10.4071/isom-2011-TP4-Paper4.
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