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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes
Cheryl Tulkoff
,
Greg Caswell
,
Manufacturability
Reliability
Leadless
Near Chip Scale
LNCSP
Pb-Free
QFN
•
https://doi.org/10.4071/isom-2011-TP4-Paper4
IMAPSource Conference Papers
Tulkoff, Cheryl, and Greg Caswell. 2011. “Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes.”
IMAPSource Proceedings
2011 (1): 341–44.
https://doi.org/10.4071/isom-2011-TP4-Paper4
.
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