Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Thermal Stress and Creep Strain Analyses of a 3D IC Integration SiP with Passive Interposer for Network System Application
Thermal Stress and Creep Strain Analyses of a 3D IC Integration SiP with Passive Interposer for Network System Application
Wu, Sheng-Tsai, John H. Lau, Heng-Chieh Chien, Yu-Lin Chao, Ra-Min Tain, Li Li, Peng Su, Jie Xue, and Mark Brillhart. 2012. “Thermal Stress and Creep Strain Analyses of a 3D IC Integration SiP with Passive Interposer for Network System Application.” IMAPSource Proceedings 2012 (1): 1038–45. https://doi.org/10.4071/isom-2012-THP14.