Thermal Stress and Creep Strain Analyses of a 3D IC Integration SiP with Passive Interposer for Network System Application

Sheng-Tsai Wu; John H. Lau; Heng-Chieh Chien; Yu-Lin Chao; Ra-Min Tain; Li Li; Peng Su; Jie Xue; Mark Brillhart

doi:10.4071/isom-2012-THP14

Loading [Contrib]/a11y/accessibility-menu.js

Wu, Sheng-Tsai, John H. Lau, Heng-Chieh Chien, Yu-Lin Chao, Ra-Min Tain, Li Li, Peng Su, Jie Xue, and Mark Brillhart. 2012. “Thermal Stress and Creep Strain Analyses of a 3D IC Integration SiP with Passive Interposer for Network System Application.” IMAPSource Proceedings 2012 (1): 1038–45. https://doi.org/10.4071/isom-2012-THP14.

View more stats