Vol. 2012, Issue 1, 2012January 01, 2012 EDT
High-Reliability Component Attachment Process for <5μm Placement Accuracy
High-Reliability Component Attachment Process for <5μm Placement Accuracy
Beck, Donald J., Zeger Bok, and Daniel Martinez. 2012. “High-Reliability Component Attachment Process for <5μm Placement Accuracy.” IMAPSource Proceedings 2012 (1): 46–54. https://doi.org/10.4071/isom-2012-TA21.
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