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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
Sensor Packaging: New Challenges for New Applications
Caroline Beelen-Hendrikx
,
Coen Tak
,
biosensor
RFID sensor
automotive sensor
open sensor package
sensor tag
high temperature package
•
https://doi.org/10.4071/isom-2010-WP5-Paper1
IMAPSource Conference Papers
Beelen-Hendrikx, Caroline, and Coen Tak. 2010. “Sensor Packaging: New Challenges for New Applications.”
IMAPSource Proceedings
2010 (1): 687–94.
https://doi.org/10.4071/isom-2010-WP5-Paper1
.
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