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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Biocompatible encapsulation and interconnection technology for implantable electronic devices

Maaike Op de Beeck, John O'Callaghan, Karen Qian, Bishoy M. Morcos, Aleksandar Radisic, Karl Malachowski, M. F. Amira, Chris Van Hoof,
implantable packagingbiomedical devicebiocompatibilityhermeticitycorrosion resistanceplatinum metallization
https://doi.org/10.4071/isom-2012-TA65
IMAPSource Conference Papers
Beeck, Maaike Op de, John O’Callaghan, Karen Qian, Bishoy M. Morcos, Aleksandar Radisic, Karl Malachowski, M. F. Amira, and Chris Van Hoof. 2012. “Biocompatible Encapsulation and Interconnection Technology for Implantable Electronic Devices.” IMAPSource Proceedings 2012 (1): 215–24. https:/​/​doi.org/​10.4071/​isom-2012-TA65.
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