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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Through Glass Via (TGV) Technology for RF Applications
A. B. Shorey
,
S. Kuramochi
,
C. H. Yun
,
Glass
Through Glass Via (TGV)
RF components
RF passives
•
https://doi.org/10.4071/isom-2015-WP25
IMAPSource Conference Papers
Shorey, A. B., S. Kuramochi, and C. H. Yun. 2015. “Through Glass Via (TGV) Technology for RF Applications.”
IMAPSource Proceedings
2015 (1): 386–89.
https://doi.org/10.4071/isom-2015-WP25
.
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