Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
EMPC Conference Proceedings (IMAPS Europe)
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
MEMS Packaging with 3D-MID Technology
Nouhad Bachnak
,
Sensor packaging
LED Packaging
Antenna
•
https://doi.org/10.4071/isom-2011-WA1-Paper6
IMAPSource Conference Papers
Bachnak, Nouhad. 2011. “MEMS Packaging with 3D-MID Technology.”
IMAPSource Proceedings
2011 (1): 484–90.
https://doi.org/10.4071/isom-2011-WA1-Paper6
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
