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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Finite Element Analysis and Measurement of Low-Profile BVATMPackage On Package (PoP) Warpage Characteristics
Akash Agrawal
,
Ashok Prabhu
,
Low Profile BVATM
Package On Package (PoP)
Warpage
Simulation
FEA
•
https://doi.org/10.4071/isom-2015-TP62
IMAPSource Conference Papers
Agrawal, Akash, and Ashok Prabhu. 2015. “Finite Element Analysis and Measurement of Low-Profile BVATMPackage On Package (PoP) Warpage Characteristics.”
IMAPSource Proceedings
2015 (1): 157–62.
https://doi.org/10.4071/isom-2015-TP62
.
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