Molded Underfill (MUF) Technology Development for SiP Module with Fine Flip Chip

Do-Jae Yoo; Ki-Chan Kim; Young-Hoon Kwak; Min-Seok Jang; Job Ha; Jae-Cheon Doh; Chang-Bae Lee; Young-Do Kweon

doi:10.4071/isom-2010-TP2-Paper2

Loading [Contrib]/a11y/accessibility-menu.js

Yoo, Do-Jae, Ki-Chan Kim, Young-Hoon Kwak, Min-Seok Jang, Job Ha, Jae-Cheon Doh, Chang-Bae Lee, and Young-Do Kweon. 2010. “Molded Underfill (MUF) Technology Development for SiP Module with Fine Flip Chip.” IMAPSource Proceedings 2010 (1): 204–11. https://doi.org/10.4071/isom-2010-TP2-Paper2.

View more stats