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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Analyses of PBGA Packaging under Strong Vibration
Yeong K. Kim
,
Do Soon Hwang
,
Reliability
PBGA
Random vibration
Solder failure
•
https://doi.org/10.4071/isom-WA44
IMAPSource Conference Papers
Kim, Yeong K., and Do Soon Hwang. 2014. “Analyses of PBGA Packaging under Strong Vibration.”
IMAPSource Proceedings
2014 (1): 488–92.
https://doi.org/10.4071/isom-WA44
.
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