Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Correlation of Through-silicon Via (TSV) Dimension Scaling to TSV Stress and Reliability for 3D Interconnects
Correlation of Through-silicon Via (TSV) Dimension Scaling to TSV Stress and Reliability for 3D Interconnects
Spinella, Laura, Jang-Hi Im, Paul S. Ho, and Tengfei Jiang. 2016. “Correlation of Through-Silicon Via (TSV) Dimension Scaling to TSV Stress and Reliability for 3D Interconnects.” IMAPSource Proceedings 2016 (1): 160–64. https://doi.org/10.4071/isom-2016-WA22.