Latest Technologies of Epoxy Molding Compound (EMC) for FO-WLP

Masahiro Iwai; Ken Ukawa; Go Ichizawa; Takeshi Mori

doi:10.4071/2380-4505-2020.1.000051

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Iwai, Masahiro, Ken Ukawa, Go Ichizawa, and Takeshi Mori. 2020. “Latest Technologies of Epoxy Molding Compound (EMC) for FO-WLP.” IMAPSource Proceedings 2020 (1): 51–56. https://doi.org/10.4071/2380-4505-2020.1.000051.

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