Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump

Yasumitsu Orii; Kazushige Toriyama; Sayuri Kohara; Hirokazu Noma; Keishi Okamoto; Daisuke Toyoshima; Keisuke Uenishi

doi:10.4071/isom-2011-WP5-Paper4

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Orii, Yasumitsu, Kazushige Toriyama, Sayuri Kohara, Hirokazu Noma, Keishi Okamoto, Daisuke Toyoshima, and Keisuke Uenishi. 2011. “Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump.” IMAPSource Proceedings 2011 (1): 828–36. https://doi.org/10.4071/isom-2011-WP5-Paper4.

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