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Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump

Yasumitsu Orii, Kazushige Toriyama, Sayuri Kohara, Hirokazu Noma, Keishi Okamoto, Daisuke Toyoshima, Keisuke Uenishi,
Flip ChipCu PillarElectromigrationlow-kIMC
https://doi.org/10.4071/isom-2011-WP5-Paper4
IMAPSource Conference Papers
Orii, Yasumitsu, Kazushige Toriyama, Sayuri Kohara, Hirokazu Noma, Keishi Okamoto, Daisuke Toyoshima, and Keisuke Uenishi. 2011. “Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump.” IMAPSource Proceedings 2011 (1): 828–36. https:/​/​doi.org/​10.4071/​isom-2011-WP5-Paper4.
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