Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump
Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump
Orii, Yasumitsu, Kazushige Toriyama, Sayuri Kohara, Hirokazu Noma, Keishi Okamoto, Daisuke Toyoshima, and Keisuke Uenishi. 2011. “Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump.” IMAPSource Proceedings 2011 (1): 828–36. https://doi.org/10.4071/isom-2011-WP5-Paper4.