Lift up! to IC Packaging: Trends and Assembly Reliability | Published in IMAPSource Proceedings

IMAPSource Conference Papers

Ghaffarian, Reza. 2016. “Lift up! To IC Packaging: Trends and Assembly Reliability.” IMAPSource Proceedings 2016 (S1): S1–28. https://doi.org/10.4071/isom-2016-slide-3.

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