Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications
Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications
Yu, Fang, R. Wayne Johnson, and Michael C. Hamilton. 2015. “Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications.” IMAPSource Proceedings 2015 (1): 654–60. https://doi.org/10.4071/isom-2015-THA45.
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