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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications
Fang Yu
,
R. Wayne Johnson
,
Michael C. Hamilton
,
High temperature operation
die attach
sintered Ag
reliability
•
https://doi.org/10.4071/isom-2015-THA45
IMAPSource Conference Papers
Yu, Fang, R. Wayne Johnson, and Michael C. Hamilton. 2015. “Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications.”
IMAPSource Proceedings
2015 (1): 654–60.
https://doi.org/10.4071/isom-2015-THA45
.
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