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Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation Packaging
Ralf Schmidt
,
5G
advanced packaging
copper
electrodeposition
redistribution layer
•
https://doi.org/10.4071/2380-4505-2019.1.000046
IMAPSource Conference Papers
Schmidt, Ralf. 2019. “Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation Packaging.”
IMAPSource Proceedings
2019 (1): 46–50.
https://doi.org/10.4071/2380-4505-2019.1.000046
.
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