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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation Packaging

Ralf Schmidt,
5G advanced packaging copper electrodeposition redistribution layer
• https://doi.org/10.4071/2380-4505-2019.1.000046
IMAPSource Conference Papers
Schmidt, Ralf. 2019. “Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation Packaging.” IMAPSource Proceedings 2019 (1): 46–50. https://doi.org/10.4071/2380-4505-2019.1.000046.
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