Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Characterization of Thermally Induced Stress in IC Packages Using PiFETs Over a Temperature Range of −180°C to 80°C
Characterization of Thermally Induced Stress in IC Packages Using PiFETs Over a Temperature Range of −180°C to 80°C
Akkara, Francy J., Uday S. Goteti, Richard C. Jaeger, Michael C. Hamilton, Michael J. Palmer, and Jeffrey C. Suhling. 2014. “Characterization of Thermally Induced Stress in IC Packages Using PiFETs Over a Temperature Range of −180°C to 80°C.” IMAPSource Proceedings 2014 (1): 500–504. https://doi.org/10.4071/isom-WA46.