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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Higher Efficiency Power Module Solutions by Chip Embedding
Kay S Essig
,
CT Chiu
,
Jarris Kuo
,
Phidia Chen
,
Jean-Marc Yannou
,
Higher Efficiency Power Module
Chip Embedding
active dies
passive components
substrate
•
https://doi.org/10.4071/isom-2016-THA21
IMAPSource Conference Papers
Essig, Kay S, CT Chiu, Jarris Kuo, Phidia Chen, and Jean-Marc Yannou. 2016. “Higher Efficiency Power Module Solutions by Chip Embedding.”
IMAPSource Proceedings
2016 (1): 402–5.
https://doi.org/10.4071/isom-2016-THA21
.
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