Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Higher Efficiency Power Module Solutions by Chip Embedding
Higher Efficiency Power Module Solutions by Chip Embedding
Essig, Kay S, CT Chiu, Jarris Kuo, Phidia Chen, and Jean-Marc Yannou. 2016. “Higher Efficiency Power Module Solutions by Chip Embedding.” IMAPSource Proceedings 2016 (1): 402–5. https://doi.org/10.4071/isom-2016-THA21.