Higher Efficiency Power Module Solutions by Chip Embedding

Kay S Essig; CT Chiu; Jarris Kuo; Phidia Chen; Jean-Marc Yannou

doi:10.4071/isom-2016-THA21

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Essig, Kay S, CT Chiu, Jarris Kuo, Phidia Chen, and Jean-Marc Yannou. 2016. “Higher Efficiency Power Module Solutions by Chip Embedding.” IMAPSource Proceedings 2016 (1): 402–5. https://doi.org/10.4071/isom-2016-THA21.

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