Higher Efficiency Power Module Solutions by Chip Embedding

Essig, Kay S, CT Chiu, Jarris Kuo, Phidia Chen, and Jean-Marc Yannou. 2016. “Higher Efficiency Power Module Solutions by Chip Embedding.” IMAPSource Proceedings 2016 (1): 402–5. https:/​/​doi.org/​10.4071/​isom-2016-THA21.