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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Higher Efficiency Power Module Solutions by Chip Embedding

Kay S Essig, CT Chiu, Jarris Kuo, Phidia Chen, Jean-Marc Yannou,
Higher Efficiency Power ModuleChip Embeddingactive diespassive componentssubstrate
https://doi.org/10.4071/isom-2016-THA21
IMAPSource Conference Papers
Essig, Kay S, CT Chiu, Jarris Kuo, Phidia Chen, and Jean-Marc Yannou. 2016. “Higher Efficiency Power Module Solutions by Chip Embedding.” IMAPSource Proceedings 2016 (1): 402–5. https:/​/​doi.org/​10.4071/​isom-2016-THA21.
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