Vol. 2016, Issue 1, 2016October 01, 2016 EDT
The Die Embedded and RDL structure on the high density substrate (i-THOP®) for mobile application
The Die Embedded and RDL structure on the high density substrate (i-THOP®) for mobile application
Kyozuka, Masahiro, Tatsuro Yoshida, Noriyoshi Shimizu, Koichi Tanaka, and Tetsuya Koyama. 2016. “The Die Embedded and RDL Structure on the High Density Substrate (i-THOP®) for Mobile Application.” IMAPSource Proceedings 2016 (1): 1–6. https://doi.org/10.4071/isom-2016-TP11.