Solder Joint Reliability Assessment for a High Performance RF Ceramic Package

Paul Charbonneau; Hans Ohman; Marc Fortin

doi:10.4071/isom-TA26

Charbonneau, Paul, Hans Ohman, and Marc Fortin. 2014. “Solder Joint Reliability Assessment for a High Performance RF Ceramic Package.” IMAPSource Proceedings 2014 (1): 62–67. https://doi.org/10.4071/isom-TA26.

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