Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology

Eiji Nakamura; Toyohiro Aoki; Ryota Yamaguchi; Nobuhiro Sekine; Kuniaki Sueoka; Chinami Marushima; Kenichi Yatsugi; Makoto Yada; Takashi Hisada

doi:10.4071/2380-4505-2020.1.000113

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Nakamura, Eiji, Toyohiro Aoki, Ryota Yamaguchi, Nobuhiro Sekine, Kuniaki Sueoka, Chinami Marushima, Kenichi Yatsugi, Makoto Yada, and Takashi Hisada. 2020. “Characterization of Sintered Cu Nanopaste for Micro-Bumping with Injection Molded Solder Technology.” IMAPSource Proceedings 2020 (1): 113–18. https://doi.org/10.4071/2380-4505-2020.1.000113.

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