Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology

Nakamura, Eiji, Toyohiro Aoki, Ryota Yamaguchi, Nobuhiro Sekine, Kuniaki Sueoka, Chinami Marushima, Kenichi Yatsugi, Makoto Yada, and Takashi Hisada. 2020. “Characterization of Sintered Cu Nanopaste for Micro-Bumping with Injection Molded Solder Technology.” IMAPSource Proceedings 2020 (1): 113–18. https:/​/​doi.org/​10.4071/​2380-4505-2020.1.000113.