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Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology

Eiji Nakamura, Toyohiro Aoki, Ryota Yamaguchi, Nobuhiro Sekine, Kuniaki Sueoka, Chinami Marushima, Kenichi Yatsugi, Makoto Yada, Takashi Hisada,
Cu nanoparticleCu pillar solder bumpInjection Molded Solder
https://doi.org/10.4071/2380-4505-2020.1.000113
IMAPSource Conference Papers
Nakamura, Eiji, Toyohiro Aoki, Ryota Yamaguchi, Nobuhiro Sekine, Kuniaki Sueoka, Chinami Marushima, Kenichi Yatsugi, Makoto Yada, and Takashi Hisada. 2020. “Characterization of Sintered Cu Nanopaste for Micro-Bumping with Injection Molded Solder Technology.” IMAPSource Proceedings 2020 (1): 113–18. https:/​/​doi.org/​10.4071/​2380-4505-2020.1.000113.
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