New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid Bonding

Yasuhisa Kayaba; Yuzo Nakamura; Jun Kamada; Kazuo Kohmura

doi:10.4071/2380-4505-2019.1.000280

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Kayaba, Yasuhisa, Yuzo Nakamura, Jun Kamada, and Kazuo Kohmura. 2019. “New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid Bonding.” IMAPSource Proceedings 2019 (1): 280–83. https://doi.org/10.4071/2380-4505-2019.1.000280.

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