Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Thin Core Substrate Large Size FCBGA Stress and Thermal Challenges and Characterization
Thin Core Substrate Large Size FCBGA Stress and Thermal Challenges and Characterization
Sung, PoHsien, Ian Hu, Penny Yang, Avis Feng, Shouyi Chin, MengKai Shih, David Tarng, Marwan Wang, and CP Hung. 2018. “Thin Core Substrate Large Size FCBGA Stress and Thermal Challenges and Characterization.” IMAPSource Proceedings 2018 (1): 110–14. https://doi.org/10.4071/2380-4505-2018.1.000110.