Thin Core Substrate Large Size FCBGA Stress and Thermal Challenges and Characterization

PoHsien Sung; Ian Hu; Penny Yang; Avis Feng; Shouyi Chin; MengKai Shih; David Tarng; Marwan Wang; CP Hung

doi:10.4071/2380-4505-2018.1.000110

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Sung, PoHsien, Ian Hu, Penny Yang, Avis Feng, Shouyi Chin, MengKai Shih, David Tarng, Marwan Wang, and CP Hung. 2018. “Thin Core Substrate Large Size FCBGA Stress and Thermal Challenges and Characterization.” IMAPSource Proceedings 2018 (1): 110–14. https://doi.org/10.4071/2380-4505-2018.1.000110.

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