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Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
Failure Analysis of Interconnection Fault in a PoP Module Applied for Mobile Phone
Hui Xiao
,
Wei Li
,
Gaoming Shi
,
Failure analysis
Interconnect reliability
PoP module
Recrystallization
•
https://doi.org/10.4071/2380-4505-2019.1.000254
IMAPSource Conference Papers
Xiao, Hui, Wei Li, and Gaoming Shi. 2019. “Failure Analysis of Interconnection Fault in a PoP Module Applied for Mobile Phone.”
IMAPSource Proceedings
2019 (1): 254–59.
https://doi.org/10.4071/2380-4505-2019.1.000254
.
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