Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Pushing the 3rd Dimension – Floppy Wafers, Die and Packages? Stress Induced Chip Package Interactions on Thin Mobile Devices
Pushing the 3rd Dimension – Floppy Wafers, Die and Packages? Stress Induced Chip Package Interactions on Thin Mobile Devices
Nakamoto, Mark, Wei Zhao, and Riko Radojcic. 2012. “Pushing the 3rd Dimension – Floppy Wafers, Die and Packages? Stress Induced Chip Package Interactions on Thin Mobile Devices.” IMAPSource Proceedings 2012 (1): 1155–61. https://doi.org/10.4071/isom-2012-THP46.