Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Reliability analysis of bonding wire based on stacked substrate packaging structure
Reliability analysis of bonding wire based on stacked substrate packaging structure
Zhang, Chi, Yifan Tan, Zhizhao Huang, Cai Chen, and Yong Kang. 2019. “Reliability Analysis of Bonding Wire Based on Stacked Substrate Packaging Structure.” IMAPSource Proceedings 2019 (1): 603–8. https://doi.org/10.4071/2380-4505-2019.1.000603.