Use of Wire Bonding to Study Bond Pad Damage from Wafer Probe

Hunter, Stevan, Jonathan L. Clark, Darin Hornberger, and Lance Rubio. 2012. “Use of Wire Bonding to Study Bond Pad Damage from Wafer Probe.” IMAPSource Proceedings 2012 (1): 384–95. https://doi.org/10.4071/isom-2012-TP41.