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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Alternative technology concepts for low-cost and high-speed 2D and 3D interconnect manufacturing

F. Roozeboom, M. Smets, B. Kniknie, M. Hoppenbrouwers, G. Dingemans, W. Keuning, W.M.M. Kessels, R. Pohl, A.J. Huis in't Veld,
3D interconnect TSV drilling and filling Spatially-divided Deep Reactive Ion Etching ALD oxide passivation Laser-Induced Forward Transfer redistribution layers
• https://doi.org/10.4071/isom-2013-TA11
IMAPSource Conference Papers
Roozeboom, F., M. Smets, B. Kniknie, M. Hoppenbrouwers, G. Dingemans, W. Keuning, W.M.M. Kessels, R. Pohl, and A.J. Huis in’t Veld. 2013. “Alternative Technology Concepts for Low-Cost and High-Speed 2D and 3D Interconnect Manufacturing.” IMAPSource Proceedings 2013 (1): 1–6. https://doi.org/10.4071/isom-2013-TA11.
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