Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Fine Pitch(40μm) Integration Platform for Flexible Hybrid Electronics using Fan-Out Wafer-level Packaging
Amir Hanna
,
Arsalan Alam
,
G. Ezhilarasu
,
Subramanian S. Iyer
,
Flexible hybrid electronics
FOWLP
Biocompatible
Flexible interconnects
Wearables
•
https://doi.org/10.4071/2380-4505-2018.1.000064
IMAPSource Conference Papers
Hanna, Amir, Arsalan Alam, G. Ezhilarasu, and Subramanian S. Iyer. 2018. “Fine Pitch(40μm) Integration Platform for Flexible Hybrid Electronics Using Fan-Out Wafer-Level Packaging.”
IMAPSource Proceedings
2018 (1): 64–68.
https://doi.org/10.4071/2380-4505-2018.1.000064
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats