Fine Pitch(40μm) Integration Platform for Flexible Hybrid Electronics using Fan-Out Wafer-level Packaging

Amir Hanna; Arsalan Alam; G. Ezhilarasu; Subramanian S. Iyer

doi:10.4071/2380-4505-2018.1.000064

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Hanna, Amir, Arsalan Alam, G. Ezhilarasu, and Subramanian S. Iyer. 2018. “Fine Pitch(40μm) Integration Platform for Flexible Hybrid Electronics Using Fan-Out Wafer-Level Packaging.” IMAPSource Proceedings 2018 (1): 64–68. https://doi.org/10.4071/2380-4505-2018.1.000064.

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