Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor
Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor
Castillou, Paul, Roberto Gaddi, Rob van Kampen, Yaojian Lin, Babak Jamshidi, and Seung Wook Yoon. 2016. “Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor.” IMAPSource Proceedings 2016 (1): 185–89. https://doi.org/10.4071/isom-2016-WA33.