Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor

Castillou, Paul, Roberto Gaddi, Rob van Kampen, Yaojian Lin, Babak Jamshidi, and Seung Wook Yoon. 2016. “Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor.” IMAPSource Proceedings 2016 (1): 185–89. https:/​/​doi.org/​10.4071/​isom-2016-WA33.