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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor
Paul Castillou
,
Roberto Gaddi
,
Rob van Kampen
,
Yaojian Lin
,
Babak Jamshidi
,
Seung Wook Yoon
,
RF-MEMS
Wafer Level Packaging
eWLB
Fanout-WLP
Embedded inductor
•
https://doi.org/10.4071/isom-2016-WA33
IMAPSource Conference Papers
Castillou, Paul, Roberto Gaddi, Rob van Kampen, Yaojian Lin, Babak Jamshidi, and Seung Wook Yoon. 2016. “Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor.”
IMAPSource Proceedings
2016 (1): 185–89.
https://doi.org/10.4071/isom-2016-WA33
.
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