Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
Control of Solder Bump Growing Morphology in Lead Free Plating
Berdy Weng
,
Wei-Wei (Xenia) Liu
,
Lu-Ming Lai
,
Kuang-Hsiung Chen
,
Solder Bump
LF Bump
Sn-Pb solder
tin-silver
Ag Composition
Flip Chip
•
https://doi.org/10.4071/2380-4505-2019.1.000488
IMAPSource Conference Papers
Weng, Berdy, Wei-Wei (Xenia) Liu, Lu-Ming Lai, and Kuang-Hsiung Chen. 2019. “Control of Solder Bump Growing Morphology in Lead Free Plating.”
IMAPSource Proceedings
2019 (1): 488–91.
https://doi.org/10.4071/2380-4505-2019.1.000488
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats