Silver oxalate: towards a new solder material for highly dissipative electronic assemblies

Kiryukhina, K., H. Le Trong, P. Tailhades, J. Lacaze, M. Gougeon, V. Baco, F. Courtade, S. Dareys, O. Vendier, and L. Raynaud. 2013. “Silver Oxalate: Towards a New Solder Material for Highly Dissipative Electronic Assemblies.” IMAPSource Proceedings 2013 (1): 836–41. https:/​/​doi.org/​10.4071/​isom-2013-THP31.